This paper presents thermal analyses of a power amplifier placed in a windtunnel. All the investigations are based on the transient temperaturemeasurements performed during the circuit cooling process. The measured coolingcurves were used to compute the cumulative and differential structure functionsfor the circuit with a heat sink. These functions helped to determine theoptimal values of circuit model parameters necessary for numerical thermalsimulations. The experiments demonstrated the influence of the wind speed onthe value of the heat transfer coefficient and consequently on the temperatureof the entire structure.
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